View SMF10AT1_828057.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SMF5.0AT1 Series Zener Transient Voltage Suppressor SOD-123 Flat Lead Package
The SMF5.0A Series is designed to protect voltage sensitive components from high voltage, high energy transients. Excellent clamping capability, high surge capability, low zener impedance and fast response time. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines, power supplies and many other industrial/consumer applications.
Specification Features: http://onsemi.com
* Stand-off Voltage: 5 - 170 Volts * Peak Power - 200 Watts @ 1 ms (SMF5.0A - SMF58A) * * * * * * * *
Peak Power - 175 Watts @ 1 ms (SMF60A - SMF170A) Maximum Clamp Voltage @ Peak Pulse Current Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000-4-2 Level 4 ESD Protection IEC61000-4-4 40 A ESD Protection Low Profile - Maximum Height of 1.0 mm Small Footprint - Footprint Area of 8.45 mm2 Supplied in 8 mm Tape and Reel - 3,000 Units per Reel Cathode Indicated by Polarity Band
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 5 - 170 VOLTS 200 WATT PEAK POWER
1 1: CATHODE 2: ANODE
2
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic
SOD-123FL CASE 498 PLASTIC
Epoxy Meets UL94, VO LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
MARKING DIAGRAM
1 CATHODE 2 ANODE
XX D
Device Meets MSL 1 Requirements
XX = Specific Device Code D = Date Code
ORDERING INFORMATION
Device SMFxxxAT1 Package SOD-123FL Shipping 3,000/Tape & Reel
LEAD ORIENTATION IN TAPE: Cathode Lead to Sprocket Holes
(c) Semiconductor Components Industries, LLC, 2003
1
March, 2003 - Rev. 0
Publication Order Number: SMF5.0AT1/D
SMF5.0AT1 Series
MAXIMUM RATINGS
Rating Maximum Ppk Dissipation (PW-10/1000 ms) (Note 1) SMF60A - SMF170A Maximum Ppk Dissipation (PW-10/1000 ms) (Note 1) SMF5.0A - SMF58A Maximum Ppk Dissipation @ TA = 25C, (PW-8/20 ms) (Note 2) DC Power Dissipation @ TA = 25C (Note 3) Derate above 25C Thermal Resistance from Junction to Ambient (Note 3) Thermal Resistance from Junction to Lead (Note 3) Operating and Storage Temperature Range 1. Non-repetitive current pulse at TA = 25C, per waveform of Figure 2. 2. Non-repetitive current pulse at TA = 25C, per waveform of Figure 3. 3. Mounted with recommended minimum pad size, DC board FR-4. Symbol Ppk Ppk Ppk PD RJA RJcathode TJ, Tstg Value 175 200 1000 385 4.0 325 26 -55 to +150 Unit W W W mW mW/C C/W C/W C
ELECTRICAL CHARACTERISTICS (TA = 25C unless
otherwise noted, VF = 3.5 V Max. @ IF (Note 4) = 12 A) Symbol IPP VC VRWM IR VBR IT IF VF Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF VC VBR VRWM IF
I
IR VF IT
V
IPP
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
Uni-Directional TVS
http://onsemi.com
2
SMF5.0AT1 Series
ELECTRICAL CHARACTERISTICS (TL = 30C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
VRWM (V) Device SMF5.0A SMF6.0A SMF6.5A SMF7.0A SMF7.5A SMF8.0A SMF8.5A SMF9.0A SMF10A SMF11A SMF12A SMF13A SMF14A SMF15A SMF16A SMF17A SMF18A SMF20A SMF22A SMF24A SMF26A SMF28A SMF30A SMF33A SMF36A SMF40A SMF43A SMF45A SMF48A SMF51A SMF54A SMF58A SMF60A SMF64A SMF70A SMF75A SMF78A SMF85A SMF90A SMF100A SMF110A SMF120A SMF130A SMF150A SMF160A SMF170A Marking KE KG KK KM KP KR KT KV KX KZ LE LG LK LM LP LR LT LV LX LZ ME MG MK MM MP MR MT MV MX MZ NE NG NK NM NP NR NT NV NX NZ PE PG PK PM PP PR (Note 5) 5 6 6.5 7 7.5 8 8.5 9 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 85 90 100 110 120 130 150 160 170 VBR @ IT (V) (Note 6) Min 6.4 6.67 7.22 7.78 8.33 8.89 9.44 10 11.1 12.2 13.3 14.4 15.6 16.7 17.8 18.9 20 22.2 24.4 26.7 28.9 31.1 33.3 36.7 40 44.4 47.8 50 53.3 56.7 60 64.4 66.7 71.1 77.8 83.3 86.7 94.4 100 111 122 133 144 167 178 189 Nom 6.7 7.02 7.6 8.2 8.77 9.36 9.92 10.55 11.7 12.85 14 15.15 16.4 17.6 18.75 19.9 21 23.35 25.6 28.1 30.4 32.8 35.1 38.7 42.1 46.8 50.3 52.65 56.1 59.7 63.15 67.8 70.2 74.85 81.9 87.7 91.25 99.2 105.5 117 128.5 140 151.5 176 187.5 199 Max 7 7.37 7.98 8.6 9.21 9.83 10.4 11.1 12.3 13.5 14.7 15.9 17.2 18.5 19.7 20.9 22.1 24.5 26.9 29.5 31.9 34.4 36.8 40.6 44.2 49.1 52.8 55.3 58.9 62.7 66.3 71.2 73.7 78.6 86 92.1 95.8 104 111 123 135 147 159 185 197 209 IT (mA) 10 10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 IR @ VRWM (mA) 400 400 250 100 50 25 10 5 2.5 2.5 2.5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VC(Max) (V) 9.2 10.3 11.2 12 12.9 13.6 14.4 15.4 17 18.2 19.9 21.5 23.2 24.4 26 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103 113 121 126 137 146 162 177 193 209 243 259 275 IPP(Max) (A) (Note 7) 21.7 19.4 17.9 16.7 15.5 14.7 13.9 13.0 11.8 11.0 10.1 9.3 8.6 8.2 7.7 7.2 6.8 6.2 5.6 5.1 4.8 4.4 4.1 3.8 3.4 3.1 2.9 2.8 2.6 2.4 2.3 2.1 1.8 1.7 1.5 1.4 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.7 0.6
5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater than the DC or continuous peak operating voltage level. 6. VBR measured at pulse test current IT at ambient temperature of 25C. 7. Surge current waveform per Figure 2 and derate per Figure 3.
http://onsemi.com
3
SMF5.0AT1 Series
TYPICAL PROTECTION CIRCUIT
Zin
Vin
LOAD
VL
10,000 PP, PEAK POWER (WATTS) tr 100 VALUE (%) PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 s PEAK VALUE - I
RSM
1000
100
50 tP
I HALF VALUE - RSM 2
10 1.0 10 100 tP, PULSE WIDTH (ms) 1000 10,000
0 0 1 2 3 4 t, TIME (ms)
Figure 1. Pulse Rating Curve
Figure 2. 10 X 1000 ms Pulse Waveform
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0
tr
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25C
160 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150
tP
20
40 t, TIME (ms)
60
80
TA, AMBIENT TEMPERATURE (C)
Figure 3. 8 X 20 ms Pulse Waveform
Figure 4. Pulse Derating Curve
http://onsemi.com
4
SMF5.0AT1 Series
P D , MAXIMUM POWER DISSIPATION (W) 1 0.7 0.5 DERATING FACTOR 0.3 0.2 0.1 0.07 0.05 0.03 0.02 10 s 0.01 0.1 0.2 0.5 1 2 5 10 20 50 100 100 s PULSE WIDTH 10 ms 3 2.5 2 TL 1.5 1 0.5 0 25 50 75 100 125 150 175 T, TEMPERATURE (C)
1 ms
D, DUTY CYCLE (%)
Figure 5. Typical Derating Factor for Duty Cycle
Figure 6. Steady State Power Derating
V F, TYPICAL FORWARD VOLTAGE (VOLTS)
1.2 1.0 0.8 0.6 0.4 0.2 0 -55 25 85 150 T, TEMPERATURE (C)
1000
C, CAPACITANCE (pF)
MEASURED @ ZERO BIAS 100
MEASURED @ 50% VRWM 10
1 1 10 100 1000 WORKING PEAK REVERSE VOLTAGE (VOLTS)
Figure 7. Forward Voltage
Figure 8. Capacitance versus Working Peak Reverse Voltage
http://onsemi.com
5
SMF5.0AT1 Series INFORMATION FOR USING THE SOD-123 FLAT LEAD SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
RECOMMENDED FOOTPRINT FOR SOD-123FL
0.91 0.036
2.36 0.093 4.19 0.165
POWERMITE POWER DISSIPATION The power dissipation of the SOD-123 Flat Lead is a function of the mounting pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOD-123 Flat Lead package, PD can be calculated as follows:
PD = TJ(max) - TA RJA
one can calculate the power dissipation of the device which in this case is 385 milliwatts.
PD = 150C - 25C = 385 milliwatts 325C/W
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C,
The 325C/W for the SOD-123 Flat Lead package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 385 milliwatts. There are other alternatives to achieving higher power dissipation from the SOD-123 Flat Lead package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad(R). Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
http://onsemi.com
6
EEE EEE EEE EEE EEE
EEE EEE EEE EEE EEE
1.22 0.048
mm inches
SMF5.0AT1 Series
OUTLINE DIMENSIONS
Transient Voltage Suppressor - Surface Mounted
200 Watt Peak Power
SOD-123FL CASE 498-01 ISSUE O
B L E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. DIM A B C D E H J K L MILLIMETERS MIN MAX 1.50 1.80 2.50 2.90 0.90 1.00 0.70 1.10 0.55 0.95 0.00 0.10 0.10 0.20 3.40 3.80 0 8 INCHES MIN MAX 0.059 0.071 0.098 0.114 0.035 0.039 0.028 0.043 0.022 0.037 0.000 0.004 0.004 0.008 0.134 0.150 0 8
A H C
D
POLARITY INDICATOR OPTIONAL AS NEEDED
K
L
J
http://onsemi.com
7
SMF5.0AT1 Series
Thermal Clad is a registered trademark of the Bergquist Company.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
http://onsemi.com
8
SMF5.0AT1/D
This datasheet has been download from: www..com Datasheets for electronics components.

▲Up To Search▲

Price & Availability of SMF10AT1

	To Download SMF10AT1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .